scia Trim 200
Scia Trim 200 is used for high-precision surface ion beam trimming or polishing of wafers or optical components, without being limited by thin films and materials. This system is designed specifically for mass production, with optimized layout to meet production capacity and maintenance needs, and can be equipped with semiconductor carrier robots that can accommodate standard wafer sizes. In addition, the combination layout can choose 2 work compartments and 2 vehicle loadlocks to increase production capacity.
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General attributesBy using a focused ion beam to bombard the surface of the sample and controlling the residence time of the ion beam focal spot in a local area, quantitative removal of surface materials can be achieved, thereby achieving polishing or surface finishing.Significantly increase production capacityThe thickness uniformity of the film can be corrected to the atomic level, up to 0.1nmEliminating edge effectsEquipped with ZBE function, capable of sub nanometer level removalThere are no restrictions on sample materialsCapacity and maintenance have been optimized during design to minimize production costs to the greatest extent possibleCan process wafers with photoresist and have good sample cooling configurationZBE：zero base etching
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configuration option
-Optional single sample loadlock or wafer carrier
-Optional combination layout includes 2 work chambers and wafer carriers
