The enhanced micro interferometer system adopts a new design concept that combines the optical system with high-precision electronic devices, and incorporates AI intelligent technology to effectively solve the problem of high aspect ratio structures blocking the detection light. It achieves non-destructive testing of high aspect ratio structures such as silicon-based MEMS comb teeth and TSV deep holes, obtains three-dimensional morphology point cloud data, and can accurately analyze key dimensional data such as groove line width, depth, and bottom roughness. The enhanced micro interferometer system can measure a maximum depth to width ratio of 30:1, a maximum depth of 300 μ m, and a minimum linewidth of 2 μ m.
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Functional Description
1. The device provides three-dimensional point cloud data that characterizes the three-dimensional morphology of high aspect ratio structures (silicon-based MEMS comb teeth, TSV deep holes);
2. The device provides measurement functions for feature dimensions such as depth, line width, and sidewall angle that characterize the three-dimensional morphology of high aspect ratio structures (silicon-based MEMS comb teeth, TSV deep holes);
3. Provide active compensation imaging at the bottom of high aspect ratio structures during measurement;
4. Provide functions such as roughness analysis, structural analysis, dimensional consistency analysis, and functional analysis in the analysis;
5. Provide auxiliary analysis functions such as one click analysis and multi file analysis in the analysis.
Internationally leading, relevant technologies have developed national standards
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Application Cases
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Technical specifications
